Name: Hong Kong repair  solder paste
Model: XG-50
Scope of application: mobile phone chip repair computer or home appliance chip patch repair BGA special products chip level repair tools

Applicable models: planting tin for mobile phone repair, BGA planting for electronic industry computers, etc.

Features: The solder joint is white and full, there is no such phenomenon as virtual soldering, false soldering, etc., and it has a strong recombination force with the soldering iron nozzle. It is a fine product in the solder paste, which is a product for repairing mobile phones and precision equipment. The most ideal product for welding on the electronic production line